Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body

ABSTRACT

A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means of an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.12/737,940, filed on May 13, 2011, which issued as U.S. Pat. No.8,530,250 on Sep. 10, 2013.

TECHNICAL FIELD

The present invention relates to a light emitting device used for lightequipment, a display, a backlight of a mobile telephone, a movielighting auxiliary light source, and other general consumer lightsources, and to a method for manufacturing a light emitting device.

BACKGROUND ART

A light emitting device using light emitting elements is small, providesgood power efficiency, and emits light of bright color. Further, thelight emitting elements are semiconductor elements, and therefore thereis no concern for blowout. The light emitting elements havecharacteristics of good initial driving performance and are robustagainst vibration and repetition of on and off of lighting. The lightemitting elements have these good characteristics, and therefore lightemitting devices using light emitting elements such as light emittingdiodes (LEDs) and laser diodes (LDs) are utilized as various lightsources.

FIG. 14 is a perspective view illustrating a method for manufacturing aconventional light emitting device. FIG. 15 is a perspective viewillustrating an intermediate of the conventional light emitting device.FIG. 16 is a perspective view illustrating the conventional lightemitting device.

Conventionally, as a method for manufacturing a light emitting device, amethod is disclosed for insert-molding a lead frame with anon-translucent, light reflecting white resin, and molding aresin-molded body which has concave cups at predetermined intervalsthrough the lead frame (e.g., refer to Patent Document 1). Althoughquality of a material of a white resin is not clearly described, as isinsertion-molding performed and as is clear from the figures, a generalthermoplastic resin is used. As a general thermoplastic resin, forexample, a thermoplastic resin such as liquid crystal polymer, PPS(polyphenylene sulfide), and nylon is often used as a light blockingresin-molded body (e.g., refer to Patent Document 2).

However, the thermoplastic resin has little adhesion with a lead frame,and the resin part and lead frame are likely to be detached. Further,the thermosetting resin has lower resin fluidity of the resin andtherefore is not adequate to mold a resin-molded body of a complicatedshape, and has little light resistance. In recent years in particular,the output of a light emitting element is remarkably improved and, asthe output of a light emitting element is increased, light deteriorationof a package made of a thermoplastic resin becomes more distinct.

In order to solve the above problems, a light emitting device using athermosetting resin for a material of a resin-molded body is disclosed(e.g., refer to Patent Document 3). FIG. 17 is a perspective view andsectional view illustrating a conventional light emitting device. FIG.18 is a schematic sectional view illustrating a method for manufacturingthe conventional light emitting device. It is disclosed that, with thislight emitting device, metal wires are formed from a metal foil by acommon method such as punching or etching and are further arranged in amold of a predetermined shape, and a thermosetting resin is filled in amold resin inlet to transfer-mold.

However, this manufacturing method has difficulty in manufacturingmultiple light emitting devices in a short time. Further, there is aproblem that a great amount of a resin of a runner part is discarded perone light emitting device.

As a different light emitting device and manufacturing method therefor,an optical semiconductor element mounting package substrate which has alight reflecting thermosetting resin composition layer on the wiringsubstrate, and manufacturing method therefor are disclosed (e.g., referto Patent Document 4). FIG. 19 is a schematic view illustrating steps ofmanufacturing a conventional light emitting device. This opticalsemiconductor element mounting package substrate is manufactured as anoptical semiconductor element mounting package substrate of a matrixpattern which has a plurality of concave parts, by attaching aprinted-wiring board having a flat plate shape to a mold, filling alight reflecting thermosetting resin composition in the mold, andheating and pressuring molding the light reflecting thermosetting resinby means of a transfer-molding machine. Further, it is also disclosedthat a lead frame is used instead of a printed-wiring board.

However, these wiring board and lead frame have a flat plate shape andhave a small adhering area because a thermosetting resin composition isarranged on this flat shape, and therefore there is a problem that, forexample, a lead frame and thermosetting resin composition are likely tobe detached upon singulation.

Patent Document 1: Japanese Patent Application Laid-Open No. 2007-35794

Patent Document 2: Japanese Patent Application Laid-Open No. 11-087780

Patent Document 3: Japanese Patent Application Laid-Open No. 2006-140207

Patent Document 4: Japanese Patent Application Laid-Open No. 2007-235085

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view illustrating a light emitting deviceaccording to a first embodiment.

FIG. 2 is a sectional view illustrating the light emitting deviceaccording to the first embodiment.

FIG. 3 is a plan view illustrating a lead frame used in the firstembodiment.

FIG. 4 is a schematic sectional view illustrating a method formanufacturing a light emitting device according to the first embodiment.

FIG. 5 is a plan view illustrating a resin-molded body according to thefirst embodiment.

FIG. 6 is a perspective view illustrating a light emitting deviceaccording to a second embodiment.

FIG. 7 is a plan view illustrating a lead frame used in the secondembodiment.

FIG. 8 is a plan view illustrating a resin-molded body according to thesecond embodiment.

FIG. 9 is a perspective view illustrating a light emitting deviceaccording to a third embodiment.

FIG. 10 is a plan view illustrating a lead frame used in the thirdembodiment.

FIG. 11 is a perspective view illustrating a light emitting deviceaccording to a fourth embodiment.

FIG. 12 is a perspective view illustrating a light emitting deviceaccording to a fifth embodiment.

FIG. 13 is a perspective view illustrating a resin package according toa sixth embodiment.

FIG. 14 is a perspective view illustrating a method for manufacturing aconventional light emitting device.

FIG. 15 is a perspective view illustrating an intermediate of aconventional light emitting device.

FIG. 16 is a perspective view illustrating a conventional light emittingdevice.

FIG. 17 is a perspective view and a sectional view illustrating aconventional light emitting device.

FIG. 18 is a schematic sectional view illustrating a method formanufacturing a conventional light emitting device.

FIG. 19 is a schematic diagram illustrating steps of manufacturing aconventional light emitting device.

DETAILED DESCRIPTION

In view of the above problems, an object of the present invention is toprovide a simple and low-cost method for manufacturing, in a short time,multiple light emitting devices which has high adhesion between a leadframe and a thermosetting resin composition.

The present invention is earnestly studied and as a result is finallycompleted.

In this description, terms such as leads, a resin part, and resinpackage are used for a singulated light emitting device, and terms suchas a lead frame and resin molded body are used in the stage prior tosingulation.

The present invention relates to a method of manufacturing a lightemitting device having a resin package which provides an opticalreflectivity equal to or more than 70% at a wavelength between 350 nmand 800 nm after thermal curing, and in which a resin part and a leadare formed in a substantially same plane in an outer side surface. Themethod comprises: a step of sandwiching a lead frame provided with anotch part, by means of an upper mold and a lower mold; a step oftransfer-molding a thermosetting resin containing a light reflectingmaterial in a mold sandwiched by the upper mold and the lower mold toform a resin-molded body in the lead frame; and a step of cutting theresin molded body and the lead frame along the notch part. With theconfiguration, the thermosetting resin is filled in the notch parts, andtherefore an adhering area between the lead frame and the thermosettingresin becomes large, so that it is possible to improve adhesion betweenthe lead frame and the thermosetting resin. Further, a thermosettingresin having lower viscosity than a thermoplastic resin is used, so thatit is possible to fill the thermosetting resin in the notch partswithout leaving a gap. Further, it is possible to manufacture multiplelight emitting devices at one time and greatly improve productiveefficiency. Furthermore, it is possible to reduce runners which arediscarded, and provide light emitting devices at low cost.

Preferably, plating processing is applied to the lead frame before thelead frame is sandwiched by the upper mold and the lower mold. In thiscase, in the manufactured light emitting device, plating processing isnot applied to a cut surface and is applied to parts other than the cutsurface. It is not necessary to apply plating processing per singulatedlight emitting device and it is possible to simplify a manufacturingmethod.

Preferably, the notch part in a cut part of the lead frame is about halfthe entire surrounding periphery. By this means, it is possible toreduce the weight of the lead frame and provide light emitting devicesat low cost. Further, the part of the lead frame to be cut decreases, sothat it is possible to better prevent the lead frame and thethermosetting resin from detaching.

In addition, the difference is that, while the thermosetting resin isfilled in the notch parts, the thermosetting resin is not filled in holeparts which are described later. While the notch parts and hole partspenetrate the lead frame, grooves which are described later do notpenetrate the lead frame.

Preferably, a hole part is provided in the lead frame before the leadframe is sandwiched by the upper mold and the lower mold. By this means,it is possible to reduce the weight of the lead frame more, and providelight emitting devices at low cost. It is possible to apply the platingprocessing to the hole parts, and consequently prevent exposure of thelead frame.

Preferably, a groove is provided in the lead frame before the lead frameis sandwiched by the upper mold and the lower mold. By this means, it ispossible to reduce the weight of the lead frame more, and provide lightemitting devices at low cost. It is possible to apply plating processingto the grooves, and consequently prevent exposure of the lead frame.

Preferably, the upper mold and the lower mold sandwich a part of thelead frame where a light emitting element is placed or near a hole part.By this means, it is possible to prevent the lead frame fromflip-flopping and reduce burrs.

The present invention relates to a light emitting device having a resinpackage having an optical reflectivity equal to or more than 70% at awavelength between 350 nm and 800 nm after thermal curing, wherein aresin part and a lead are formed in a substantially same plane in anouter side surface, and wherein at least one surface of a bottom surfaceand an upper surface of a lead is plated and the outer side surface ofthe lead is not plated. By this means, it is possible to preventexposure of leads to which plating processing is not applied, andprovide multiple light emitting devices at one time. Further, byapplying plating processing to only the part which reflects light from alight emitting element, it is possible to improve the efficiency toextract light from the light emitting device.

Preferably, the lead is exposed at four corners of the resin package.The exposed parts of the leads are reduced compared to leads which areprovided on the one entire side surface of a resin package, so that itis possible to improve adhesion between the resin part and the leads.Further, the insulating resin part is provided between a positive leadand a negative lead, so that it is possible to prevent short circuiting.

Preferably, four corners of the resin package are formed in an arc shapeseen from a bottom surface side. It is also possible to employ aconfiguration where plating processing is applied to a part which isformed in an arc shape and is not applied to the cut surface. By thismeans, it is possible to expand a bonding area with, for example, asolder, and improve the boding strength.

Preferably, a step is provided in the lead. The differences in level arepreferably provided in the bottom surface of the resin package. It isalso possible to employ a configuration where plating processing isapplied to a part in which differences in level are formed and is notapplied to the cut surface. By this means, it is possible to expand abonding area with, for example, a solder, and improve the bodingstrength.

The present invention relates to a method for manufacturing a resinpackage having an optical reflectivity equal to or more than 70% at awavelength between 350 nm and 800 nm after thermal curing, wherein aresin part and a lead are formed in a substantially same plane in anouter side surface. The method comprising: a step of sandwiching a leadframe provided with a notch part, by means of an upper mold and a lowermold; a step of transfer-molding a thermosetting resin containing alight reflecting material in a mold sandwiched by the upper mold and thelower mold to form a resin-molded body in the lead frame; and a step ofcutting the resin-molded body and the lead frame along the notch part.With the configuration, the thermosetting resin is filled in the notchparts, and therefore an adhering area between the lead frame and thethermosetting resin becomes large, so that it is possible to improveadhesion between the lead frame and the thermosetting resin. Further, athermosetting resin having lower viscosity than a thermoplastic resin isused, so that it is possible to fill the thermosetting resin

in the notch parts without leaving a gap. Further, it is possible tomanufacture multiple resin packages at one time and greatly improveproductive efficiency. Furthermore, it is possible to reduce runnerswhich are discarded, and provide resin packages at low cost.

Preferably, plating processing is applied to the lead frame before thelead frame is sandwiched by the upper mold and the lower mold. In thiscase, in the manufactured resin package, plating processing is notapplied to a cut surface and is applied to parts other than the cutsurface. It is not necessary to apply plating processing per singulatedresin package and it is possible to simplify a manufacturing method.

The present invention relates to a resin package having an opticalreflectivity equal to or more than 70% at a wavelength between 350 nmand 800 nm after thermal curing, wherein a resin part and a lead areformed in a substantially same plane in an outer side surface, andwherein at least one surface of a bottom surface and an upper surface ofa lead is plated and the outer side surface of the lead is not plated.By this means, it is possible to prevent exposure of leads to whichplating processing is not applied, and provide multiple resin packagesat one time. Further, by applying plating processing to only the partwhich reflects light from a light emitting element, it is possible toimprove the efficiency to extract light from the light emitting device.

The present invention relates to a method of manufacturing aresin-molded body having an optical reflectivity equal to or more than70% at a wavelength between 350 nm and 800 nm after thermal curing,wherein a plurality of concave parts are formed, and in which a part ofa lead frame is exposed in inner bottom surfaces of the concave parts.The method comprises: a step of sandwiching the lead frame by means ofan upper mold which has convex parts in positions where the concaveparts adjacent in the resin molded body are molded and a lower mold, thelead frame being provided with notch parts; a step of transfer-molding athermosetting resin containing a light reflecting material in a moldsandwiched by the upper mold and the lower mold to fill thethermosetting resin in the notch parts, and forming the resin-moldedbody in the lead frame. With this configuration, it is possible tomanufacture multiple light emitting devices at one time and greatlyimprove productive efficiency.

The present invention relates to a resin-molded body having an opticalreflectivity equal to or more than 70% at a wavelength between 350 nmand 800 nm after thermal curing, wherein a plurality of concave partsare formed and a part of a lead frame is exposed in inner bottomsurfaces of the concave parts, and wherein the lead frame has notchparts and a thermosetting resin which becomes the resin-molded body isfilled, the resin-molded body having a sidewall between adjacent concaveparts. By this means, it is possible to provide a resin-molded body ofgood thermal resistance and light resistance.

The light emitting device and manufacturing method therefor according tothe present invention can provide a light emitting device which provideshigh adhesion between a lead frame and a resin-molded body. Further, itis possible to provide multiple light emitting devices in a short timeand greatly improve production efficiency. Furthermore, it is possibleto reduce runners which are discarded, and provide light emittingdevices at low cost.

Hereinafter, the preferred embodiments of a method for manufacturing alight emitting device and a light emitting device according to thepresent invention will be described in detail with drawings. However,the present invention is not limited to this embodiment.

<First Embodiment>

(Light Emitting Device)

A light emitting device according to a first embodiment will bedescribed. FIG. 1 is a perspective view illustrating a light emittingdevice according to the first embodiment. FIG. 2 is a sectional viewillustrating a light emitting device according to the first embodiment.FIG. 2 is a sectional view taken along line II-II illustrated in FIG. 1.FIG. 3 is a plan view illustrating a lead frame used in the firstembodiment.

A light emitting device 100 according to the first embodiment providesan optical reflectivity equal to or greater than 70% at the wavelengthbetween 350 nm and 800 nm after thermal curing, and has a resin package20 in which a resin part 25 and leads 22 are formed in the substantiallysame plane in outer side surfaces 20 b. Plating processing is applied toat least one surface of the bottom surface (an outer bottom surface 20 aof the resin package 20) and the upper surface (an inner bottom surface27 a of a concave part 27) of the leads 22. By contrast with this,plating processing is not applied to the side surfaces of the leads 22(the outer side surfaces 20 b of the resin package 20). The resin part25 occupies a large area in the outer side surfaces 20 b of the resinpackage 20, and leads 22 are exposed from corner parts.

The resin package 20 is formed with the resin part 25 which mainlycontains a light reflecting material 26, and the leads 22. The resinpackage 20 has the outer bottom surface 20 a in which the leads 22 arearranged, outer side surfaces 20 b in which part of the leads 22 areexposed, and the outer upper surface 20 c in which an opening concavepart 27 is formed. In the resin package 20, the concave part 27 havingan inner bottom surface 27 a and inner side surface 271) is formed. Theleads 22 are exposed in the inner bottom surface 27 a of the resinpackage 20 and the light emitting element 10 is placed on the leads 22.In the concave part 27 of the resin package 20, a sealing member 30which covers the light emitting element 10 is arranged. The sealingmember 30 contains a fluorescent material 40. The light emitting element10 is electrically connected with the leads 22 through wires 50. Theleads 22 are not arranged on the outer upper surface 20 c of the resinpackage 20.

Parts from which the leads 22 are exposed have the half or less lengththan the entire surrounding length of the outer side surfaces 20 b ofthe resin package 20. In a method for manufacturing a light emittingdevice which is described below, notch parts 21 a are provided in a leadframe 21 and the lead frame 21 is cut along the notch parts 21 a and,therefore, the cut part of the lead frame 21 is a part which is exposedfrom the resin package 20.

In the resin package 20, the leads 22 are exposed from the four corners.The leads 22 are exposed in the outer side surfaces 20 b, and are notsubjected to plating processing. Further, the leads 22 may be adapted tobe exposed in the outer bottom surface 20 a and subjected to platingprocessing. In addition, it is possible to apply plating processing tothe outer side surfaces 20 b of the leads 22 after singulation.

The light emitting device 100 provides the optical reflectivity equal toor more than 70% at the wavelength between 350 nm and 800 nm afterthermal curing. This means that the optical reflectivity in a visiblelight area is high. The light emitting element 10 preferably provides alight emission peak wavelength between 360 nm and 520 nm, and can alsouse a light emission peak wavelength between 350 nm and 800 nm. Morepreferably, the light emitting element 10 has a light emission peakwavelength in a short wavelength region of visible light between 420 nmand 480 nm. This resin package 20 has good light resistance againstlight of a short wavelength equal to or less than 480 nm, and is lesslikely to be deteriorated. Further, this resin package 20 is not likelyto be deteriorated even when the light emitting element 10 generatesheat by applying the current thereto, and has good thermal resistance.

It is preferable to use as the resin package 20 a translucentthermosetting resin highly filled with a light reflecting material. Itis preferable to use, for example, a thermosetting resin which providesthe optical transmittance equal to or more than 80% at 350 nm to 800 nm,and it is more preferable to use a thermosetting resin which providesoptical transmittance equal to or more than 90%. This is because it ispossible to prevent deterioration of the resin package 20 by reducinglight which is absorbed by the thermosetting resin. The light reflectingmaterial 26 preferably reflects 90% or more light from the lightemitting element 10, and more preferably reflects 95% or more light.Further, the light reflecting material 26 preferably reflects 90% ormore light from the fluorescent material 40, and more preferablyreflects 95% or more light. By reducing the amount of light which isabsorbed by the light reflecting material 26, it is possible to improvethe efficiency to extract light from the light emitting device 100.

Although the light emitting device 100 may have any shape, the lightemitting device 100 may have a polygonal shape such as a generallyrectangular parallelepiped, generally cube, or generally hexagonalcolumn. The concave part 27 preferably expands in the opening direction,and may have a cylindrical shape. The concave part 27 can adopt agenerally circular shape, generally oval shape, or generally polygonalshape.

Hereinafter, each member will be described below.

(Light Emitting Element)

Although a light emitting element is preferably used in which asemiconductor such as GaAlN, ZnS, SnSe, SiC, GaP, GaAlAs, AlN, InN,AlInGaP, InGaN, GaN or AlInGaN is formed on a substrate as a lightemitting layer, the semiconductor is not limited to these. Although thelight emitting element which provides a light emission peak wavelengthbetween 360 nm and 520 nm is preferable, and a light emitting elementwhich provides a light emission peak wavelength between 350 nm and 800nm can be used. More preferably, the light emitting element 10 has thelight emission peak wavelength in the short wavelength region of visiblelight between 420 nm and 480 nm.

The light emitting element adopting a face-up structure can be used,and, in addition, the light emitting element adopting a face-downstructure can also be used. The size of the light emitting element isnot particularly limited, and light emitting elements having sizes of350 μm (350-μm-square), 500 μm (500-μm-square) and 1 mm (1-mm square)can be used. Further, a plurality of light emitting elements can beused, and all of the light emitting elements may be the same type or maybe different types which emit emission colors of red, green and blue ofthree primary colors of light.

(Resin Package)

The resin package has and is made by integrally molding a resin partformed with a thermosetting resin and the leads. Although the resinpackage provides an optical reflectivity equal to or more than 70% at350 nm to 800 nm, the resin package more preferably provides an opticalreflectivity equal to or more than 80% at 420 nm to 520 nm. Further, theresin package preferably has a high reflectivity in a light emittingarea of a light emitting element and a light emitting area of afluorescent material.

The resin package has an outer bottom surface, outer side surfaces andan outer upper surface. The leads are exposed from the outer sidesurfaces of the resin package. The resin part and leads are formed inthe substantially same plane. This substantially same plane means thatthe resin part and leads are formed in the same cutting step.

The outer shape of the resin package is not limited to a generallyrectangular parallelepiped, and may have a generally cube, generallyhexagonal shape or other polygonal shapes. Further, the resin packageseen from the outer upper surface side can also adopt a generallytriangular shape, generally square shape, generally pentagonal shape orgenerally hexagonal shape.

The resin package forms a concave part having an inner bottom surfaceand an inner side surface. The leads are arranged in the inner bottomsurface of the concave part. The concave part seen form the outer uppersurface side can adopt various shapes such as a generally circularshape, generally oval shape, generally square shape, generally polygonalshape or combination of these. Although the concave part preferably hasa shape expanding in the opening direction, the concave part may have acylindrical shape. Although the concave part may be provided with asmooth inclination, the concave part may be formed in a shape which hasa minute concavity and convexity in its surface and diffuses light.

The leads are provided at predetermined intervals to form a pair ofpositive and negative leads. Plating processing is applied to the leadsin the inner bottom surface of the concave part and the leads of theouter bottom surface of the resin package. Although this platingprocessing can be performed before a resin-molded body is cut out, it ispreferable to use a lead frame to which plating processing is applied inadvance. By contrast with this, plating processing is not applied to theside surfaces of the leads.

(Resin Part and Resin-molded Body)

As the material of the resin part and resin-molded body, a triazinederivative epoxy resin, which is a thermosetting resin is preferablyused. Further, the thermosetting resin can contain an acid anhydride,antioxidant, demolding member, light reflecting member, inorganicfiller, curing catalyst, light stabilizer, and lubricant. The lightreflecting member uses titanium dioxide and is filled with 10 to 60% byweight of titanium dioxide.

The resin package is not limited to the above mode, and is preferablymade of at east one selected from the group consisting of an epoxyresin, modified epoxy resin, silicone resin, mollified silicone resin,acrylate resin, and urethane resin of a thermosetting resin.Particularly, the epoxy resin, modified epoxy resin, silicone resin ormodified silicone resin is preferable. For example, it is possible touse as a solid epoxy resin composition, 100 parts by weight of a clearand colorless mixture in which the epoxy resin consisting oftriglycidylisocyanuratem, bisphenol hydride A glycidyl ether and so on,and an acid anhydride consisting of hexahydrophthalic anhydride,3-methylhexahydrophthalic anhydride, 4-methylhexahydrophthalic anhydrideand so on equivalent to the epoxy resin, have been dissolved and mixed,which has been added with: 0.5 parts by weight of DBU (1,8-Diazabicyclo(5,4,0)undecene-7) as a curing accelerator; 1 parts by weight ofethylene glycol as a promoter; 10 parts by weight of a titanium oxidepigment; and 50 parts by weight of a glass fiber, and which has enteredthe B stage by being heated and partially cured and reacted.

(Lead and Lead Frame)

Although a metal plate of a flat plate shape can be used for a leadframe, a metal plate in which differences in level or concavity andconvexity are provided can be used.

The lead frame is formed by, for example, punching or etching a metalplate of a flat plate shape. A concavity and convexity are formed in asectional shape of the etched lead frame, so that it is possible toimprove adhesion between the lead frame and resin.molded body.Particularly when a thin lead frame is used, although, with punching,differences in level or concave-convex shapes are formed to improveadhesion between a lead frame and resin-molded body, the effect ofimproving adhesion is little because the differences in level orconcave-convex shapes are small. However, etching can formconcave-convex shapes in the entire sectional (etched part) part of thelead frame, so that it is possible to increase a bonding area betweenthe lead frame and resin-molded body and mold a resin package of betteradhesion.

By contrast with this, the method of punching a metal plate of a flatplate shape increases cost required for replacement parts due tofriction of a mold resulting from the punching, and increases costrequired for manufacturing the lead frame. By contrast with this, withetching, a punching mold is not used, so that it is possible tomanufacture a lead frame per package at low cost when the number ofpackages cut from one frame is greater.

The etching may be performed such that the lead frame is penetrated, ormay be started from only one surface such that the lead frame is notpenetrated.

The notch parts are formed such that a pair of positive and negativeleads are provided when the resin-molded body is singulated to the resinpackage. The notch parts are formed such that the area for cutting theleads is reduced when the resin-molded body is cut. For example, thenotch parts are provided in a horizontal direction such that a pair ofpositive and negative leads are provided, and further notch parts areprovided in positions corresponding to cut-out parts for singulating theresin-molded body. Meanwhile, part of the lead frame is jointed suchthat part of the lead frame does not drop or the leads are exposed inthe outer side surfaces of the resin package. To singulate theresin-molded body using a singulation saw, the notch parts arepreferably formed vertically and horizontally or linearly in an obliquedirection.

The lead frame is formed using an electrical good conductor such asiron, phosphor bronze or a copper alloy. Further, to increase thereflectivity with respect to light from the light emitting element,metal plating using silver, aluminum, copper, gold or the like can beapplied to the lead frame. Although metal plating is preferably isapplied to the lead frame before the lead frame is sandwiched by theupper mold and lower mold, that is, for example, after the notch partsare provided or etching processing is performed, metal plating can alsobe applied to the lead frame before the lead frame is integrally moldedwith the thermosetting resin.

(Sealing Member)

The material of a sealing member is a thermosetting resin. The sealingmember is preferably made of at least one selected from the groupconsisting of an epoxy resin, modified epoxy resin, silicone resin,modified silicone resin, acrylate resin and urethane resin of athermosetting resin, and is more preferably made of an epoxy resin,modified epoxy resin, silicone resin or modified silicone resin. Thesealing member is preferably made of a hard material to protect thelight emitting element. Further, it is preferable to use for the sealingresin a resin having good thermal resistance, weather resistance andlight resistance. To provide a predetermined function, the sealingmember may be mixed with at least one selected from the group consistingof filler, diffusing agent, pigment, fluorescent material and reflectingmaterial. The sealing member may contain a diffusing agent. As aspecific diffusing agent, for example, barium titanate, titanium oxide,aluminum oxide or silicon oxide is adequately used. Further, the sealingmember can contain an organic or inorganic colored dye or coloredpigment in order to cut an undesirable wavelength. Further, the sealingmember can also contain a fluorescent material which absorbs light fromthe light emitting element and converts the wavelength.

(Fluorescent Material)

A fluorescent material may be a material which absorbs light from thelight emitting element, and converts the wavelengths into light of adifferent wavelength. The fluorescent material is preferably selectedfrom, for example, at least any one of a nitride phosphor, oxynitridephosphor or sialon phosphor mainly activated by a lanthanoid elementsuch as Eu or Ce, alkaline-earth halogen apatite phosphor,alkaline-earth metal boric acid halogen phosphor, alkaline-earth metalaluminate phosphor, alkaline-earth silicate, alkaline-earth sulfide,alkaline-earth thiogallate, alkaline-earth silicon nitride or germanatemainly activated by a lanthanoid element such as Eu or a transitionmetal such as Mn, rare-earth aluminate or rare-earth silicon nitridemainly activated by a lanthanoid element such as Ce, or organic andorganic complexes mainly activated by a lanthanoid element such as Eu.As a specific example, although the following phosphors can be used, thefluorescent material is not limited to these.

The nitride phosphor mainly activated by a lanthanoid element such as Euor Ce includes, for example, M₂Si₅N₈:Eu or MAlSiN₃:Eu (where M is atleast one or more selected from Sr, Ca, Ba, Mg and Zn). Further, thenitride phosphor also includes MSi₇N₁₀:Eu, M_(1.8)Si₅O_(0.2)N₈:Eu orM_(0.9)Si₇O_(0.1)N₁₀:Eu in addition to M₂Si₅N₈:Eu (where M is at leastone or more selected from Sr, Ca, Ba, Mg and Zn).

The oxynitride phosphor mainly activated by a lanthanoid element such asEu or Ce includes, for example. MSi₂O₂N₂:Eu (where M is at least one ormore selected from Sr, Ca, Ba, Mg and Zn).

The sialon phosphor mainly activated by a lanthanoid element such as Euor Ce includes, for example, M_(p/2)Si_(12p−q)Al_(p+q)O_(q)N_(16−p):Ceor M-Al—Si—O—N (M is at least one selected from Sr, Ca, Ba, Mg and Zn, qis 0 to 2.5, and p is 1.5 to 3).

The alkaline-earth halogen apatite phosphor mainly activated by alanthanoid element such as Eu or a transition metal such as Mn includes,for example, M₅(PO₄)₃X:R (M is at least one or more selected from Sr,Ca, Ba, Mg and Zn, X is at least one or more selected from F, Cl, Br andI and R is at least one or more selected from Eu, Mn, Eu and Mn).

The alkaline-earth metal boric acid halogen phosphor includes, forexample, M₂B₅O₉X:R (M is at least one or more selected from Sr, Ca, Ba,Mg and Zn, X is at least one or more selected from F, Cl, Br and I, andR is at least one or more selected from Eu, Mn, Eu and Mn).

The alkaline-earth metal aluminate phosphor includes, for example,SrAl₂O₄:R, Sr₄Al₁₄O₂₅:R, CaAl₂O₄:R, BaMg₂Al₁₆O₂₇:R, BaMg₂Al₁₆O₁₂:R, orBaMgAl₁₀O₁₇:R (R is at least one or more selected from Eu, Mn, Eu andMn).

The alkaline-earth sulfide phosphor includes, for example, La₂O₂S:Eu,Y₂O₂S:Eu or Gd₂O₂S:Eu.

The rare-earth aluminate phosphor mainly activated by a lanthanoidelement such as Ce includes, for example, YAG phosphors represented bycomposition formulae of Y₃Al₅O₁₂:Ce, (Y_(0.8)Gd_(0.2))₃Al₅O₁₂:Ce,Y₃(Al_(0.8)Ga_(0.2))₅O₁₂:Ce and (Y,Gd)₃(Al,Ga)₅O₁₂:Ce. Further, therare-earth aluminate phosphor also includes Tb₃Al₅O₁₂:Ce or Lu₃Al₅O₁₂:Cewhere part or all of Y is substituted with, for example, Tb or Lu.

The other phosphors include, for example, ZnS:Eu, Zn₂GeO₄:Mn orMGa₂S₄:Eu (where M is at least one or more selected from Sr, Ca, Ba, Mgand Zn).

By using one kind alone or two or more kinds in combination, thesephosphors can realize blue, green, yellow and red and, in addition,tinges such as turquoise, greenish yellow and orange which areintermediate colors of blue, green, yellow and red.

(Others)

In the light emitting device, a zener diode can also be further providedas a protective element. The zener diode can be placed on the leads inthe inner bottom surface by being placed apart from the light emittingelement. Further, a configuration can also be employed where a zenerdiode is placed on leads in the inner bottom surface of the concave partand a light emitting

element is placed on the zener diode. The size of 280 μm and, inaddition, the size of 300 μm can be used.

(Method for Manufacturing Light Emitting Device According to FirstEmbodiment)

The method for manufacturing a light emitting device according to thefirst embodiment will be described. FIG. 4 is a schematic sectional viewillustrating a method for manufacturing a light emitting deviceaccording to the first embodiment. FIG. 5 is a plan view illustrating aresin-molded body according to the first embodiment.

The method for manufacturing a light emitting device according to thefirst embodiment includes the steps of sandwiching the lead frame 21provided with the notch parts 21 a by means of an upper mold 61 and alower mold 62, transfer-molding a thermosetting resin 23 containing thelight reflecting material 26, in a mold 60 sandwiched by the upper mold61 and the lower mold 62 to form a resin-molded body 24 in the leadframe 21, and cutting the resin-molded body 24 and lead frame 21 alongthe notch parts 21 a.

First, the mold 60 formed with the upper mold 61 and lower mold 62 usedfor transfer-molding will be described.

The upper mold 61 has a main body part of a flat plate which forms anupper part of the upper mold, an outer wall part which is formed in aframe shape from end parts of the main body, a plurality of projectingparts which project from the main body part, and an inlet whichpenetrates part of the outer wall part in the horizontal direction.

The outer wall part vertically projects from the end parts of the mainbody part, and has a first outer wall part, a second outer wall part, athird outer wall part and a fourth outer wall part which form a firstouter side surface, a second outer side surface, a third outer sidesurface and a fourth outer side surface of the resin molded body,respectively. That is, the outer wall part is used for molding theoutline of the resin-molded body, and formed in a rectangular shape seenfrom a plan view. The shape of the outer wall part only needs to beadequately formed according to a desirable shape of the resin-moldedbody.

The projecting parts contact the lead frame 21 upon transfer-molding,and can form an exposed part from which part of the lead frame 21 isexposed from the resin-molded body 24 by preventing the thermosettingresin 23 from flowing in the contacting parts. The projecting partsproject downward from the main body part, and are formed by beingsurrounded by the outer wall. The parts of the projecting partscontacting the lead frame 21 are formed flat. To efficiently form aconcave part in an area in the upper surface of the resin molded body24, the projecting parts are preferably formed in one direction at equalintervals, and the projecting parts are preferably formed at equalintervals in a direction 90 degrees from the one direction of eachprojecting part.

The inlet is used to inject the thermosetting resin 23, and is formedpenetrating in the horizontal direction in the lower end of thesubstantially center of the outer wall part. The inlet has asemicircular cross sectional surface, and is formed with a widthnarrowed toward the outlet part from the inlet part of the inlet.

Further, although not illustrated, a pin insertion hole which penetratesthe main body part is formed in the upper part of the upper mold 61. Thepin insertion hole is used for insertion of the pin when theresin-molded body 24 is demolded from the upper mold 61.

The lower mold 62 is a plate material with a predetermined thickness,and its surface is formed flat. The lower mold 62 is placed in contactwith the upper mold 61 to mold a space part.

Next, each manufacturing step will be described.

After the notch parts 21 a are provided, metal plating processing isapplied to the lead frame 21.

First, the lead frame 21 provided with the notch parts 21 a issandwiched by the upper mold 61 and lower mold 62. By sandwiching thelead frame 21 by the upper mold 61 and lower mold 62, space is providedin the mold 60.

In this case, the notch parts 21 a in positions where the concave parts27 are formed are arranged such that the notch parts 21 a are sandwichedby the projecting parts of the upper mold 61 and the lower mold 62. Bythis means, it is possible to prevent flip-flop of the lead frame 21 inthe notch parts 21 a, and reduce burrs.

Next, the thermosetting resin 23 containing the light reflectingmaterial 26 is transfer-molded in the mold sandwiched by the upper mold61 and lower mold 62, and the thermosetting resin 23 containing thelight reflecting material 26 is injected through the inlet to the spaceprovided in the mold 60 which forms the resin-molded body 24 on the leadframe 21 and is applied a predetermined temperature and pressure totransfer-mold. The lead frame 21 near the notch parts 21 a aresandwiched by the upper mold 61 and lower mold 62, so that, when thethermosetting resin 23 is transfer-molded, it is possible to preventflip-flop of the lead frame 21 and reduce burrs in the inner bottomsurface 27 a of the concave part 27.

The pin is inserted in the pin inserting part to remove the resin-moldedbody 24 from the upper mold 61. Preferably, the resin-molded body 24 istemporarily cured by being applied a predetermined temperature in themold 60, then is removed from the mold 60 and is finally cured by beingapplied a higher temperature than temporary curing.

Next, the light emitting element 10 is placed on the lead frame 21 ofthe inner bottom surface 27 a of the concave part 27 formed in theresin-molded body 24 to electrically connect with the lead frame 21through the wires 50. With the step of placing the light emittingelement 10, the resin-molded body 24 can be placed after theresin-molded body 24 is removed from the mold 60, or the light emittingelement 10 may be placed on the resin package 20 obtained by cutting andsingulating the resin-molded body 24. Further, the light emittingelements may be faced down and mounted without using the wires. Afterthe light emitting element 10 is mounted on the lead frame 21, thesealing member 30 containing the fluorescent material 40 is filled andcured in the concave part 27.

Next, the resin-molded body 24 and lead frame 21 are cut along the notchparts 21 a. The resin-molded body 24 in which a plurality of concaveparts 27 are formed is cut in the longitudinal direction and lateraldirection such that the sidewalls between adjacent concave parts 27 areseparated in the substantially center. The cutting method uses asingulation saw, and starts singulation from the resin-molded body 24side. By this means, in the cutting surface, the resin-molded body 24and lead frame 21 are in the substantially same plane, and the leadframe 21 is exposed from the resin-molded body 24. By providing thenotch parts 21 a in this way, the lead frame 21 to be cut decreases, sothat it is possible to prevent the lead frame 21 and resin-molded body2,1 from being detached. Further, not only the upper surface of the leadframe 21, but also the side surfaces corresponding to the notch parts 21a adhere to the resin-molded body 24, so that the adhesion strengthbetween the lead frame 21 and resin molded body 24 is improved.

<Second Embodiment>

A light emitting device according to a second embodiment will bedescribed. FIG. 6 is a perspective view illustrating a light emittingdevice according to the second embodiment. FIG. 7 is a plan viewillustrating a lead frame used in the second embodiment. FIG. 8 is aplan view illustrating a resin molded body according to the secondembodiment. Description of some configurations employing thesubstantially same configuration as the light emitting device accordingto the first embodiment will be omitted where necessary.

With the light emitting device according to the second embodiment, thelight emitting element 10 is placed in the concave part provided in theresin package 120. The corner parts of the outer upper surface 120 c ofthe resin package 120 are formed in an arc shape. Further, the sidesurface of the lead 122 is formed in an arc shape seen from the uppersurface, and the lead 122 is provided with a step such that the lead 122slightly projects from the resin part 125 seen from the upper surface.Plating processing is applied to the upper surfaces, outer bottomsurfaces 120 a and arc-shaped curved parts of the projecting leads 122.By contrast with this, plating processing is not applied to the outerside surfaces 120 b other than the arc-shaped parts of the leads 122. Byincreasing the parts to which plating processing is applied in this way,the bonding strength with a conductive material such as a solderincreases.

(Method for Manufacturing Light Emitting Device According to SecondEmbodiment)

With the method for manufacturing a light emitting device according tothe second embodiment, notch parts 121 a and hole parts 121 b areprovided in the lead frame 121. Although the shapes of these hole pads121 b are preferably circular, the hole parts 121 b can adopt apolygonal shape such as a square shape or hexagonal shape, or an ovalshape. The positions of the hole parts 121 in the lead frame 121 arepreferably provided on the extension of the notch parts 121 a and near apoint where the notch parts 121 a cross each other. Although the holeparts 121 b may adopt any sizes, the holes parts 121 b are preferablywider to use for electrodes and increase the bonding strength with aconductive material. Further, it is possible to expand the adhering areawith the conductive material, and increase the bonding strength.

Slightly larger holes than the shapes of the hole parts 121 b areprovided to cover the vicinity of the hole parts 121 b of the lead frame121.

The lead frame 121 in which the notch parts 121 a are provided issandwiched by an upper mold and lower mold. In this case, the vicinityof the hole parts 121 b is sandwiched by the molds. By this means, upontransfer-molding, a thermosetting resin is not poured into the holeparts 121 b and the thermosetting resin in the hole parts 121 b do notneed to be removed.

A thermosetting resin containing a light reflecting material istransfer-molded in the mold sandwiched by the upper mold and lower moldto form the resin-molded body 124 in the lead frame 121.

Plating processing is applied to the exposed part of the lead frame 121of the resin-molded body 124. Plating processing is applied to the innerbottom surface of the concave part, outer bottom surface 120 a of theresin package 120, circular inner surface of the lead frame 121 and theupper surface extending therefrom.

The resin-molded body 124 and lead frame 121 are cut along the notchparts 121 a.

By performing the above steps, it is possible to provide the lightemitting device according to the second embodiment. The holes 121 b areprovided on the extension of the notch parts 121 a, so that, whensingulation is performed using a singulation saw, it is possible toreduce the time required for cutting the lead frame 121 because the leadframe 121 to be cut is little. According to this manufacturing method,it is possible to easily provide in a short time a light emitting devicewhich has many plated parts in the lead frame 121.

<Third Embodiment>

A light emitting device according to a third embodiment will bedescribed. FIG. 9 is a perspective view illustrating the light emittingdevice according to the third embodiment. FIG. 10 is a plan viewillustrating a lead frame used in the third embodiment. Description ofsome configurations employing the substantially same configuration asthe light emitting device according to the first embodiment will beomitted where necessary.

The light emitting device according to the third embodiment provides anoptical reflectivity equal to or greater than 70% at the wavelengthbetween 350 nm and 800 nm after thermal curing, and has a resin package220 in which a resin part 225 and leads 222 are formed in thesubstantially same plane in an outer side surface 220 b. Platingprocessing is applied to the bottom surface and upper surface of theleads 222, and is not applied to the outer side surfaces. The lead 222has a predetermined thickness, and is provided with differences in levelnear the outer side surfaces of the resin package 220. Platingprocessing applied to the side surfaces which are one step deeper in thedifferences in level, and the bottom surface which slightly jutsoutward. By providing the plate difference in the lead 222 in this way,the bonding area increases, so that it is possible to improve thebonding strength with a conductive material such as a solder. Further,it is possible to reduce the thickness of part of the lead 222 to be cutusing the singulation saw, and reduce the cutting time. Further,singulation is started from the outer upper surface of the resin package220 using the singulation saw, and therefore burrs extending in thedirection of the outer bottom surface are likely to be produced in thecutting surface of the lead 222. In case where the cutting surfaces andouter bottom surfaces of the leads are in the same plane, although thereare cases where the light emitting device is inclined due to burrs whenthe light emitting device is mounted, differences in level are providedin the cutting surfaces of the leads and therefore the burrs do notreach the outer bottom surface, so that the light emitting device is notinclined due to the burrs.

In the lead 222 which is exposed from the resin package 220, the step isformed with a first surface which is exposed in the outer bottom surface220 a of the resin package 220, a second surface which is formed at asubstantially right angle from the outer bottom surface 220 a in anupward direction, a third surface which is formed at a substantiallyright angle from the second surface in the direction of the outer sidesurface of the resin package 220, and a fourth surface which is exposedin the outer side surface of the resin package 220. Although platingprocessing is applied to the first surface, second surface and thirdsurface, plating processing is not applied to the fourth surface. Thesecond surface and third surface can also be formed as one curvedsurface. When the second surface and third surface are formed as onecurved surface, a solder readily expands in the step.

The resin package 220 forms a generally square shape in the outer uppersurface 220 c, and is covered by the resin part 225. A generally conictrapezoidal concave part is provided on the outer upper surface 220 cside of the resin package 220.

(Method for Manufacturing Light Emitting Device According to ThirdEmbodiment)

With the method for manufacturing a light emitting device according tothe third embodiment, grooves 221 c of substantially straight lines areprovided in the lead frame 221 on the side corresponding to the outerbottom surface side of the light emitting device. Although the depth ofthese grooves 221 c is preferably half the thickness of the lead frame221, the groove 221 c may have about ¼ to ⅘ of the depth. Although thewidth of this groove 221 c is variously changed according to, forexample, the distance to an adjacent concave part or the size of thelight emitting device, the groove 221 c only needs to have the depththat can be recognized as the step in the light emitting device when thecenter of the groove is cut.

The lead frame 221 provided with notch parts 221 a is sandwiched by theupper mold and lower mold. The notch parts 221 a are sandwiched by theupper mold and lower mold and prevented from flip-flopping upontransfer-molding.

By transfer-molding a thermosetting resin containing a light reflectingmaterial in the mold sandwiched by the upper mold and lower mold, aresin-molded body is formed in the lead frame 221.

Plating processing is applied to the exposed part of the lead frame 221of the resin-molded body. Plating processing is applied to the innerbottom surface of the concave part, the outer bottom surface 220 a ofthe lead frame 221, and grooves 221 c. Plating processing of thesegrooves 221 c is applied to the first surface, second surface and thirdsurface in the differences in level in the light emitting device.

The resin molded body and lead frame are cut along the notch parts 221a. Further, the resin-molded body is cut along the grooves 221 c.

By performing the above steps, it is possible to provide the lightemitting device according to the third embodiment. According to thismanufacturing method, it is possible to easily provide in a short time alight emitting device which has many plated parts in the lead frame 121.

<Fourth Embodiment>

A light emitting device according to a fourth embodiment will bedescribed. FIG. 11 is a perspective view illustrating a light emittingdevice according to the fourth embodiment. Description of someconfigurations employing the substantially same configuration as thelight emitting device according to the first embodiment will be omittedwhere necessary.

The light emitting device according to the fourth embodiment hasdifferences in level which are dented in the portions of the outer sidesurfaces 320 b, in the leads 322 of the outer side surfaces 320 b of theresin package 320. In the lead 322 which is exposed from the resinpackage 320, the step is formed with a first surface which is providedin the outer bottom surface 320 a of the resin package 320, a secondsurface which is formed at a substantially right angle from the outerbottom surface 320 a in an upward direction, a third surface which isformed at a substantially right angle from the second surface in thedirection of the outer side surface of the resin package 320, and afourth surface of the outer side surface of the resin package 320. Theouter upper surface 320 c of the resin package 320 is formed in agenerally rectangular shape formed with a resin part a25. Platingprocessing is applied to the outer bottom surface 320 a, first surface,second surface provided with a step, third surface and the inner bottomsurface of the concave part. By contrast with this, plating processingis not applied to the outer side surfaces 320 b provided with no thestep are not provided.

An etched lead frame is used for the leads 322. In the cut surface ofthe resin-molded body, the etched leads 322 have a concavity andconvexity. This concavity and convexity improve adhesion between theresin part and leads.

By providing the differences in level in part of the leads 322, it ispossible to expand the bonding area with a conductive material uponmounting, and increase the bonding strength. Further, a concavity isprovided in the lead frame, so that it is easy to cut the lead frame andreduce the time required for cutting.

<Fifth Embodiment>

A light emitting device according to a fifth embodiment will bedescribed. FIG. 12 is a perspective view illustrating the light emittingdevice according to the fifth embodiment. Description of someconfigurations employing the substantially same configuration as thelight emitting device according to the first embodiment will be omittedwhere necessary.

The light emitting device according to the fifth embodiment hasdifferences in level which are dented in the portions of outer sidesurfaces 420 b, in the leads 422 of the outer side surfaces 420 b of theresin package 420. In the lead 422 which is exposed from the resinpackage 420, the step is formed with a first surface which is providedin the outer bottom surface 420 a of the resin package 420, a secondsurface which is formed at a substantially right angle from the outerbottom surface 420 a in an upward direction, a third surface which isformed at a substantially right angle from the second surface in thedirection of the outer side surface of the resin package 420, and afourth surface of the resin package 420. In the outer side surface 420 bof the resin package 420, the leads 422 are separated into six. Theleads 422 may be separated respectively, or jointed. The leads 422provided with notch parts are more preferable than the leads of a fglateplate shape because a bonding strength between the resin part 425 andleads 422 becomes high. The outer upper surface 420 c of the resinpackage 420 is formed in a generally rectangular shape formed with theresin part 425. Plating processing is applied to the outer bottomsurface 420 a, first surface, second surface provided with the step, thethird surface and the inner bottom surface of the concave part. Bycontrast with this, plating processing is not applied to the outer sidesurfaces 420 b provided with no step.

By providing the differences in level in part of the leads 422, it ispossible to expand a bonding area with a conductive member, and increasethe bonding strength. Further, a concavity is provided in the leadframe, so that it is easy to cut the lead frame and it is possible toreduce the time required for cutting.

<Sixth Embodiment>

A resin package according to a sixth embodiment will be described. FIG.13 is a perspective view illustrating the resin package according to thesixth embodiment. Description of some configurations employing the sameconfiguration as the resin package according to the first embodiment andthe resin package according to the fifth embodiment will be omittedwhere necessary.

The resin package according to the sixth embodiment has differences inlevel dented in the corner parts in the leads 522 of the outer sidesurfaces 520 b of the resin package 520. This step has an arc shape seenfrom the outer bottom surface 520 a side in the lead 522 exposed fromthe resin package 520. This arc shape is obtained by dividing a circleinto four. This arc shape is obtained by etching the circle tosubstantially half the thickness of the circle so as not to penetratethe lead 522, and then cutting the circle into four. Plating processingis applied to the parts of these arc shapes. Plating processing isapplied to these arc shape parts and outer bottom surface 520 a beforethe circle is divided into four. By contrast with this, platingprocessing is not applied to the outer side surfaces 520 b provided withno the step. The resin package 520 forms a generally square shape seenfrom the outer upper surface 520 c, from which the resin part 525 isexposed.

By providing the differences in level in the leads 522, it is possibleto expand a bonding area with a conductive material, and increase thebonding strength. Further, even when burrs are produced in parts of thedifferences in level when the resin-molded body is cut, the burrs areprovided above the outer bottom surface 520 a, so that the resin-moldedbody does not teeter when the resin-molded body is jointed with aconductive material. Further, concavities are provided in the leadframe, so that it is easy to cut the resin frame and it is possible toreduce the time required for cutting.

EXAMPLE

The light emitting device according to Example 1 will be described.Overlapping description of the light emitting device described in thefirst embodiment will be omitted where necessary. FIG. 1 is aperspective view illustrating the light emitting device according to thefirst embodiment. FIG. 2 is a sectional view illustrating the lightemitting device according to the first embodiment. FIG. 2 is a sectionalview taken along line II-II illustrated in FIG. 1. FIG. 3 is a plan viewillustrating the lead frame used in the first embodiment.

The light emitting device 100 has the light emitting element 10, and theresin package 20 in which the resin part 25 containing the lightreflecting material 26 and the leads 22 are integrally molded. The lightemitting element 10 is a nitride semiconductor light emitting elementwhich emits blue light with the light emission peak wavelength at 450nm. The resin package 20 has a generally rectangular parallelepipedshape having a mortar-shaped concave part 27. The size of the resinpackage 20 is 35 mm long, 35 mm wide and 0.8 mm high, and asubstantially diameter on the outer upper surface 20 c side of theconcave part 27 is 2.9 mm, a substantially diameter of the inner bottomsurface 27 a is 2.6 mm and the depth is 0.6 mm. The thickness of thelead 22 is 0.2 mm. Titanium oxide is used for the light reflectingmaterial 26. An epoxy resin which is a thermosetting resin is used forthe resin part 25. The epoxy resin contains about 20% by weight oftitanium oxide. The resin package 20 provides the optical reflectivityof 81% at the wavelength of 450 nm after thermal curing. The resin part25 and leads 22 are formed in the substantially same plane in the outerside surfaces 20 b of the resin package 20. The leads 22 are exposedfrom the four corners of the resin package 20. With the leads 22,plating processing is applied to the outer bottom surface 20 a of theresin package 20 and the inner bottom surface 27 a of the concave part27. By contrast with this, with the leads 22, plating processing is notapplied to the outer side surfaces 20 b of the resin package 20. Thesealing member 30 containing the fluorescent material 40 which emitsyellow light is filled in the concave part 27. (Y,Gd)₃(Al,Ga)₅O₁₂:Ce isused for the fluorescent material 40. A silicone resin is used for thesealing member 30.

This light emitting device is manufactured as follows.

The lead frame is provided with the notch parts 21 a by etching.Although not illustrated, a concavity and convexity are formed in thecross-sectional surface of the notch part 21 a. Ag is adhered to thelead frame by electrolytic plating. The plated lead frame 21 providedwith the notch parts 21 a is used.

Next, the lead frame 21 of a predetermined size is sandwiched by theupper mole 61 and lower mold 62. The lead frame 21 has a flat plateshape, and is provided with the notch parts 21 a matching the size ofthe light emitting device to be singulated. The notch parts 21 a areprovided in the vertical direction and horizontal direction such that,when the resin package 20 is singulated, the four corners are exposedand the parts other than the four corners are not exposed. Further, thenotch parts 21 a are provided in the horizontal direction such that,when the resin package 20 is singulated, the notch parts 21 a areelectrically insulated, and are sandwiched by the upper mold 61 andlower mold 62.

The thermosetting resin 23 containing the light reflecting material 26is transfer-molded in the mold 60 sandwiched by the upper mold 61 andlower mold 62 to form the resin-molded body 24 in the lead frame 21. Thethermosetting resin 23 containing the light reflecting material 26 isprocessed to a pellet, and heated and pressured to poured in the mold60. At this time, the thermosetting resin 23 is also filled in the notchparts 21 a. After temporarily curing the thermosetting resin 23 whichhas poured, the upper mold 61 is removed and the thermosetting resin 23is further heated and finally cured. By this means, the resin-moldedbody 24 in which the lead frame 21 and thermosetting resin 23 areintegrally molded is manufactured.

Next, the light emitting element 10 is mounted on the leads 22 of theinner bottom surface 27 a of the concave part 27 using a die bondmember. After the light emitting element 10 is placed, the lightemitting element 10 and the leads 22 are electrically connected usingthe wires 50. Next, the sealing member 30 containing the fluorescentmaterial 40 is filled in the concave part 27.

Finally, the resin-molded body 24 and lead frame 21 are cut along thenotch parts 21 a and singulated into individual light emitting devices100. By this means, plating processing is not applied to the cut partsof the leads 22.

By performing the above steps, it is possible to manufacture multiplelight emitting devices 100 at one time.

The present invention can be utilized for light equipment, a display,backlight of a mobile telephone, a movie lighting auxiliary light sourceand other general consumer light sources.

The invention claimed is:
 1. A method of manufacturing a light emittingdevice having a resin package in which a resin part and a lead areformed in a substantially same plane in an outer side surface, themethod comprising: sandwiching a lead frame provided with a notch part,between an upper mold and a lower mold; transfer-molding a thermosettingresin containing a light reflecting material in a space located betweenthe upper mold and the lower mold such that the thermosetting resinfills the notch part, to form a resin-molded body in the lead frame, aportion of the resin molded body being located in the notch part; andcutting the resin-molded body and the lead frame along the notch part,wherein the lead frame is plated before being sandwiched by the uppermold and the lower mold.
 2. The method according to claim 1, wherein thenotch part in a cut part of the lead frame occupies more than about halfof an entire surrounding periphery of the lead frame.
 3. The methodaccording to claim 1, wherein, a hole part is provided in the lead framebefore the lead frame is sandwiched by the upper mold and the lowermold.
 4. The method according to claim 1, wherein a groove is providedin the lead frame before the lead frame is sandwiched by the upper moldand the lower mold.
 5. The method according to claim 1, wherein theupper mold and the lower mold sandwich a part of the lead frame where alight emitting element is placed.
 6. A light emitting device having aresin package, wherein a resin part and at least one lead are formed ina substantially same plane in an outer side surface, wherein at leastone surface of a bottom surface and an upper surface of the at least onelead is plated and the outer side surface of the at least one lead isnot plated, wherein the resin part has a “T” shape at least at two sidesurfaces of the resin package, and wherein the at least one lead hasexposed portions located at four corners of the resin package, theexposed portions being separated from each other by the resin part atfour side surfaces of the resin package.
 7. The light emitting deviceaccording to claim 6, wherein the four corners of the resin package areformed in an arc shape seen from a bottom surface side.
 8. The lightemitting device according to claim 6, wherein a step lowered from abottom surface or outer surface is provided in the lead.
 9. The lightemitting device according to claim 6, wherein said resin part comprisesa light reflecting material.
 10. The light emitting device according toclaim 6, wherein said resin part comprises titanium oxide.
 11. A methodof manufacturing a resin package in which a resin part and a lead areformed in a substantially same plane in an outer side surface, themethod comprising: sandwiching a lead frame provided with a notch part,between an upper mold and a lower mold; transfer-molding a thermosettingresin containing a light reflecting material in a space located betweenthe upper mold and the lower mold such that the thermosetting resinfills the notch part, to form a resin-molded body in the lead frame, aportion of the resin molded body being located in the notch part; andcutting the resin-molded body and the lead frame along the notch part,wherein the lead frame is plated before being sandwiched by the uppermold and the lower mold.
 12. The method according to claim 1, furthercomprising placing a light emitting element on said lead frame.
 13. Themethod according to claim 1, further comprising placing a light emittingelement on said lead frame before cutting the resin-molded body and thelead frame along the notch part.
 14. The method according to claim 1,wherein said resin-molded body has a concave part for receiving a lightemitting element.
 15. The method according to claim 1, wherein saidlight reflecting material is titanium dioxide.
 16. The method accordingto claim 11, wherein said light reflecting material is titanium dioxide.17. A method of manufacturing a light emitting device having a resinpackage in which a resin part and a lead are formed in a substantiallysame plane in an outer side surface, the method comprising: sandwichinga lead frame provided with a notch part, between an upper mold and alower mold; transfer-molding a thermosetting resin in a space locatedbetween the upper mold and the lower mold such that the thermosettingresin fills the notch part, to form a resin-molded body in the leadframe, a portion of the resin molded body being located in the notchpart; wherein the notch part is configured such that the resin-moldedbody and the lead frame are cuttable at the notch part, and wherein thelead frame is plated before being sandwiched between the upper mold andthe lower mold.
 18. The method according to claim 17, wherein said leadframe has a surface on which a light emitting element is placeable. 19.The method according to claim 17, wherein said resin-molded body has aconcave part configured to receive a light emitting element.
 20. Themethod according to claim 17, wherein said thermosetting resin comprisesa light reflecting material.
 21. The method according to claim 17,wherein said thermosetting resin comprises titanium dioxide.